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High resolution beam imaging systems - BIS |
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High-resolution beam imaging is made possible with the Colutron
Beam Imaging Systems (BIS).
The BIS can be used to measure two or three dimensional intensity
distributions of ion, electron and neutral beams.
The BIS can also be used to image X-rays for applications such
as pinhole imaging and spectroscopy.
Images are created using a microchannel plate (MCP) and phosphor screen. The phosphor is uniformly deposited onto a coherent fiberoptic (FO) substrate so that the image can be optically transmitted to the outside of a vacuum system for analysis using a FO conduit. |
| model BIS-3135 with BIS-1-PH probe head | |
| The BIS systems are available in many different configurations with several options for image readout to best fit a customer's particular application and budget. | |
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| model BIS-4135 (Remote System) | model BIS-4105 (Standard System) |
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| 4 keV OH+ ion beam ( 0.86mm FWHM ) made with model G-1 ion gun system. model BIS-1035 beam imaging system, and IPS-1 image processing system. |
| Beam Imaging System (BIS)-General Description | |
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Probe Heads |
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Fiberoptic Conduits |
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CCD and CID Camera Options |
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BIS Ordering Information |
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Beam Imaging System Dimensions |
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Beam Imaging System Specifications |
| BEAM IMAGING SYSTEM - (BIS) |
| General Description |
| The BIS systems consist of three basic components: 1) the BIS probe head which houses the MCP and phosphor screen; 2) a fiberoptic conduit which optically transmits the image from the probe head to a fiberoptic vacuum feedthrough; and, 3) a camera system for digital readout of the image. These components are described in detail below. |
PROBE HEAD
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| The BIS probe head creates an image of a beam by converting the incoming beam to electrons by secondary electron emission from the probe head microchannel plate (MCP). The electrons are then accelerated onto a phosphor screen with enough energy to excite the phosphor and create an image. The phosphor is deposited uniformly across a coherent fiberoptic (FO) disc or taper. The BIS-1 systems use a 1:1 magnification FO disc whereas, in order to image larger areas, the BIS-2, BIS-3 and BIS-4 systems use FO tapers with corresponding magnifications of 2x, 3x, and 4x. Optional microsphere MSP plates are also available in a single or dual stack. These plates have higher gain per stage, no ion feedback, and less severe vacuum requirements than MCPs, but have poorer spatial resolution (see MSP - MCP Comparison Chart and Imaging System Specifications . All BIS probe heads are interchangeable, allowing the user to change image resolution and image area by simply switching the probe head. |
| Probe Head Specifications | ||
| Probe Head model number | image area | approximate spatial resolution |
| BIS-1-PH | 17mm diam. | 25µm - 35µm |
| BIS-2-PH | 25.4mm diam. | 50µm - 70µm |
| BIS-3-PH | 38.4mm diam. | 75µm - 100µm |
| BIS-4-PH | ~ 44.45mm diam. | 150µm |
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PROBE HEAD - OPTIONAL CONFIGURATIONS
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Probe heads are available with a single MCP (standard) or dual MCP (chevron) configuration for increased gain. Also available are microsphere plates (MSP) in single or dual stack. These plates have higher gain per stage and less severe vacuum requirements, but have poorer spatial resolution (see Beam Imaging Specifications on page 27). |
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The Phosphor Screens come standard with P-20 phosphor and conductive aluminum coating. Other phosphors are available upon special request, as well as an Indium-Tin-Oxide (ITO) coating. ITO screens are generally used when lower electron accelerating voltages are required, however the quantum yield may be lower than that of aluminized screens. |
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The probe heads also allow for mounting a variety of apertures, slits, lenses, pinholes, filters and grids. All probe heads have holes for mounting 1/8" (3mm) diameter ceramic mounting rods. Colutron offers a small selection of grids that can be mounted in front of the probe head for applications such as electron suppression, beam attenuation, and beam acceleration. A 4-terminal high voltage feedthrough on 2 3/4" (DN35) conflat flange is provided with the BIS system for the phosphor screen and MCP voltage application. |
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The input microchannel plate is also available with performance enhancement coatings to enhance the detection efficiency for certain types of radiation. The table below outlines the available coatings. |
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coating
type |
Radiation type
enhanced |
Energy Range |
coating
thickness (Å) |
coating extension
(Channel Diameters) |
| CuI | UV | 200 ~ 2,000Å | 3,000 | 1.5 |
| CsI | UV | 200 ~ 2,000Å | 3,000 | 1.5 |
| MgFl2 | UV | 350 ~ 1,200Å | 3,000 | 1.5 |
| KBr | X-Ray | 0.2 ~ 9 keV | 3,000 | 1.5 |
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FIBEROPTIC CONDUITS
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| Images are transmitted optically from the probe head through one of two types of FO conduits which both include a 2·3/4" (DN35) conflat Ò FO vacuum viewport enabling imaging on the outside of the vacuum chamber CID camera options below). Conduits consist of either a flexible 60cm long, 10mm x 8mm rectangular FO cable (Remote System) or 19mm diameter solid FO rod (Standard System) which is available in various lengths. Both conduit types attach at one end to the BIS probe head, and to the FO viewport at the other end. The remote systems with flexible FO cable are especially useful for imaging particle beams deep within the vacuum chamber where the beam cannot be brought to a vacuum port for imaging. The 60cm length is standard, however other lengths are available on request. The standard systems with solid FO rod are generally used when the beam can be brought close to a vacuum port for imaging. The FO rod is available in various lengths to allow for greater flexibility when adapting to a customer's particular application. | |
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CCD and CID camera options
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Optional CCD and
camera readout systems are available for all BIS systems.
All cameras are available with lens, video monitor and mounting
system for imaging the FO viewport.
The CIDTEC 3710D and COHU 4812 cameras are also available with
fiberoptic faceplates (FOFP) directly attached to the camera sensor.
The camera sensor is then mounted in a special housing which allows
them to directly mate to the FO viewport.
This direct FO coupling approach ensures highest possible resolution
and gain.
The camera can be connected to a video monitor in order to observe images in real time, and can also be connected to a video frame grabber making it possible to store and analyze the images later. Colutron offers the optional Image Processing Systems-IPS which include video monitor, frame grabber, cables and software. |
| CCD / CID camera specifications | |||
| camera | CIDTEC 3710D | COHU 4812 | COHU 2122 |
| Optical Format | 2/3" diagonal | 2/3" diagonal | 1/2" diagonal |
| resolution | 755H x 484V | 755H x 488V | 768H x 494V |
| Element Pitch (µm) | 12.0 x 13.7 | 11.5 x 27 | 8.4 x 9.8 |
| area (mm) | 9.05 x 6.83 | 8.8 x 6.6 | 6.4 x 4.8 |
| FOFP (optional) | 4.5 µm pitch | 4.5 µm pitch | n/a |
| scanning format | RS-170, 2:1 interlace | EIA RS-170 | EIA RS-170 |
| electronic shutter | 1/60 - 1/10,000 sec. | ||
| sync. system | int. / ext. | int. / ext. | int. / ext. |
| signal to noise (dB) | 50 | 50 | > 55 |
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sensitivity
(face plate illumination) |
full output: 0.5fc | full output: 0.2 lux | full output: 0.65 lux |
| input power (Watts) | 8.5 max. | 4.2 | 3.6 |
| input voltage (Volts) | +12V.dc | +12V.dc | + 15V.dc nominal |
| BIS Ordering Information |
| Use the table below to determine the BIS model that fits your application. For example, a model BIS-3135 decodes as a BIS system with BIS-3-PH probe head, dual MCPs, 60cm long fiberoptic cable with 2·3/4" (DN35) conflatÒ viewport, and fiberoptically coupled CIDTEC 3710D camera. NOTE: All BIS systems include a four terminal, 2·3/4" conflat (DN35) high voltage feedthrough (Colutron part number PN-706). |
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BIS-X
Probe Head |
X
MCP options |
X
FO conduit |
X
camera system |
| 1 - BIS-1-PH | 0 - single MCP |
0 - FO rod ( 2" long ) / FO viewport |
0 - none |
| 2 - BIS-2-PH | 1 - dual MCP |
1 - FO Rod ( 3" long) / FO viewport |
1 - COHU 2122/Lens/mount |
| 3 - BIS-3-PH | 2 - single MSP |
2 - FO Rod ( 4" long ) / FO viewport |
2 - COHU 4812/Lens/mount |
| 4 - BIS-4-PH | 3 - dual MSP |
3 - FO cable ( 60cm ) / FO viewport |
3 - CIDTEC 3710D/Lens/mount |
| 4 - none ( phosphor only ) | 4 - COHU 4812/FOFP/mount | ||
| 5 - special coating ( specify type ) | 5 - CIDTEC 3710D/FOFP/mount |
| REMOTE SYSTEM DIMENSIONS |
| The dimensions for the BIS system with optional FO cable and CIDTEC camera with FOFP are shown below. |
| Remote beam imaging system diagram |
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| DIMENSIONS ( Remote Beam Imaging Systems ) | |||||
| models * |
BIS-1X35
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BIS-2X35 | BIS-3X35 | BIS-4X35 | |
| dimensions (mm) | |||||
| A | 83.5 | 83.5 | 83.5 | 83.5 | |
| B | 68.3 | 68.3 | 68.3 | 68.3 | |
| C | 108.0 | 108.0 | 108.0 | 108.0 | |
| D | 63.5 | 76.2 | 88.9 | 101.5 | |
| E | 24.8 | 43.3 | 56.3 | 70.09 | |
| F | 12.7 | 12.7 | 12.7 | 12.7 | |
| G | 566.7 | 566.7 | 566.7 | 566.7 | |
| H | 4.7 | 4.7 | 4.7 | 4.7 | |
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Cable end-tip
O.D. (f ) |
34.3 | 34.3 | 34.3 | 34.3 | * note: The model number X descriptor determines the MCP option |
| STANDARD BEAM IMAGING SYSTEM DIAGRAM |
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| models * | BIS-1X05 | BIS-1X15 | BIS-1X25 | BIS-2X05 | BIS-2X15 | BIS-2X25 | |
| dimensions (mm) | |||||||
| A | 83.5 | 83.5 | 83.5 | 83.5 | 83.5 | 83.5 | |
| B | 68.3 | 68.3 | 68.3 | 68.3 | 68.3 | 68.3 | |
| C | 108.0 | 108.0 | 108.0 | 108.0 | 108.0 | 108.0 | |
| D | 63.5 | 63.5 | 63.5 | 76.2 | 76.2 | 76.2 | |
| E | 24.8 | 24.8 | 24.8 | 43.3 | 43.3 | 43.3 | |
| F | 12.7 | 12.7 | 12.7 | 12.7 | 12.7 | 12.7 | |
| G | 23.6 | 49.0 | 74.4 | 23.6 | 49.0 | 74.4 | |
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Fiberoptic
Rod O.D. |
19.1 | 19.1 | 19.1 | 19.1 | 19.1 | 19.1 | |
| models * | BIS-3X05 | BIS-3X15 | BIS-3X25 | BIS-4X05 | BIS-4X15 | BIS-4X25 | |
| dimensions (mm) | |||||||
| A | 83.5 | 83.5 | 83.5 | 83.5 | 83.5 | 83.5 | |
| B | 68.3 | 68.3 | 68.3 | 68.3 | 68.3 | 68.3 | |
| C | 108.0 | 108.0 | 108.0 | 108.0 | 108.0 | 108.0 | |
| D | 88.9 | 88.9 | 88.9 | 101.5 | 101.5 | 101.5 | |
| E | 56.3 | 56.3 | 56.3 | 70.09 | 70.09 | 70.09 | |
| F | 12.7 | 12.7 | 12.7 | 12.7 | 12.7 | 12.7 | |
| G | 23.6 | 49.0 | 74.4 | 23.6 | 49.0 | 74.4 | |
| Fiberoptic Rod O.D. | 19.1 | 19.1 | 19.1 | 19.1 | 19.1 | 19.1 | |
| BIS SPECIFICATIONS | |
| imaging area: | |
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9.1mm x 6.6 mm COLUTRON model BIS-1000 series,
18.2mm x 13.2 mm COLUTRON model BIS-2000 series, 27.3mm x 19.8mm COLUTRON model BIS-3000 series, approx. 36.4mm x 26.4mm COLUTRON model BIS-4000 series |
| camera: CID | |
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776H x 512V total pixels, 755H x 484V displayed pixels, 12.0µm x 13.7µm pixel size |
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+ 15V.dc nominal (+11.0 to + 17.0) input Voltage |
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RS-170, 2:1 interlace scanning format |
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Full output at 0.3fc faceplate illumination ( T=2,850°K ) |
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Spectral Response: 0.11 Amps/Watt at l = 560 nm (P-20) |
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Quantum Efficiency: ~23 % at l = 560 nm (P-20) |
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Fiberoptic Faceplate 4.5µm pitch, 4mm thick |
| fiberoptic cable: | |
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10.0 mm x 8.0 mm image area, 10 micron square fiber size |
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(Remote Systems) 600 mm length, flexible, UHV compatible |
| fiberoptic rod: | |
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Available in 2", 3" or 4" lengths, 3/4" diameter |
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(Standard Systems) 6µm diameter fiber size |
| MCP (standard) | |
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0.975" diameter, single plate (BIS-1000 series), chevron (BIS-1100 series) |
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1.289" diameter, single plate (BIS-2000 series), chevron (BIS-2100 series) |
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1.970" diameter, single plate (BIS-3000, BIS-4000 series), chevron (BIS-3100, BIS-4100 series) |
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10µm channel diameter |
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Max. gain: 2.0 x 10 4 (single plate), 1.0 x 10 7 (chevron) |
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Spatial resolution: 41 lp/mm |
| MSP (oPtional) | |
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0.980" diameter, single plate (BIS-1200 series), chevron (BIS-1300 series) |
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1.291" diameter, single plate plate (BIS-2200 series), chevron (BIS-2300 series) |
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1.970" diameter, single plate (BIS-3200, BIS-4200 series), chevron (BIS-3300, BIS-4300 series) |
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50 micron sphere diameter |
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Max. gain: 1.5 x 10 6 (one plate, 3000V), 1.0 x 109 (dual plate, 4000V) |
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Spatial resolution: 2 lp/mm |
| Phosphor Screen: | |
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P-20 deposited onto aluminized fiberoptic faceplate, fiber Size: 6µm diameter |
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Conversion efficiency: h = 0.063 photons / eV / electron |
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P-20 peak wavelength: l = 560 nm |
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Optional ITO (Indium Tin Oxide) coating available |
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Optional P-11, P-43, P-46, P-47 phosphor coatings available |
| Power Supply Requirements: ( see optional PCU power control units ) | |
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0 ~ +1,000 V, 1 mA single microchannel plate |
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0 ~ +2,000 V, 1 mA dual microchannel plate (chevron) |
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0 ~ +3,000 V, 1mA single microsphere plate |
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0 ~ +4,000 V, 1mA dual microsphere plate |
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0 ~ +5,000 V, 1 mA phosphor screen |
| Vacuum: | |
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1 x 10-6 torr or better required to operate MCP, 1 x 10-5 or better to operate MSP |
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Good to at least 1 x 10-10 torr; maximum bakeout temp. 150°C |
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Local sales representative in Japan
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| Colutron Research Corporation | APACE Science |
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2321 Yarmouth Avenue,
Boulder, Colorado 80301 U.S.A. |
Mitomo-Bldg.#2 - 6F, Ebisu-nishi 2-Chome,
2 - 8, Shibuya-Ku, Tokyo 150-0021 Japan |
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phone#
Fax# |
+1 (303) 443-5211
+1 (303) 449-5050 |
phone#
Fax# |
+81 (0)3 - 3463 - 3204
+81 (0)3 - 3463 - 3205 |
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| contact: | Erik Wahlin, Ph.D. | ||||
| e-mail: | erik@colutron.com | ||||
| web: | http://www.colutron.com/ | ( Last updated: ) | |||
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